Thermal Technologist, Fellow of American Society of Mechanical Engineers, made outstanding industry wide contributions to the cooling of electronic packages and mobile/portable consumer electronic devices. Previously held technology/engineering leadership roles, led corporate thermal technology teams and roadmaps, working on leading-edge mobile/wireless technologies with Motorola (1999-2010), Qualcomm (2010 - 2018) and Futurewei/Huawei R&D USA (2018 - 2019). Dr. Chiriac was elected Chair of the ASME K-16 Electronics Cooling Committee and was elected the Arizona and New Mexico IMAPS (International Microelectronics and Packaging Society) Chapter President in 2010. He is a co-editor of Electronics Cooling Magazine since 2016 and a leading member of the organizing committees of ASME/InterPack, ASME/ IMECE and IEEE/CPMT ITherm Conferences. Has 19 U.S. issued patents, 1 US Trade Secret, 1 US Defensive Publication and has published over 107 papers in scientific journals and at international conferences. PhD (1999) in Aerospace and Mechanical Engineering, University of Arizona, Tucson, USA.